|
PERFORMANCE
TEST
|
TEST
METHOD
|
APPRAISE
|
|
Temperature
Coefficient
|
MIL-STD-202F,
Method
304 -55℃ to +125℃
|
±100ppm/℃
|
|
Thermal
Shock
|
MIL-STD-202F,
Method
107 5cycles,-55℃
to+125℃
|
±0.5%
|
|
Low
Temperature Operation
|
MIL-R-55342D,
Para.4.7.4
One
hour at-55℃
followed by 45 minutes RCWV
|
±0.5%
|
|
Short
Time Overload
|
MIL-R-55342D,
Para.4.7.5
2.5times
RCWV for 5 seconds
|
±0.5%
|
|
High
Temperature Exposure
|
MIL-R-55342D,
Para.4.7.6
125℃
for 100 hours
|
±0.5%
|
|
Resistance
to Soldering Heat
|
MIL-R-55342D,
Para.4.7.7
Soldered
to test board at 260℃
for 10 seconds
|
±0.5%
|
|
Moisture
Resistance
|
MIL-STD-202F,
Method
106 10 cycles, Total 240 hour
|
±0.5%
|
|
Life
|
MIL-STD-202F,
Method
108A 1000 hours at 70℃
RCWV intermittent
|
±0.5%
|
|
Solderability
|
MIL-STD-202F,
Method
208 230℃
for 5 seconds
|
95%min.coverage
|